S3088 Ultra – Hign Speed 3D AOI
S3088 Ultra Gold
显著特点
可靠的高速3D焊点检测
- 快速AOI相机系统
- 可缩放、模块化的传感器（镜头）技术，带有三维测量功能
- 高检测深度: 可靠检测03015 和微小引脚
- 最大的缺陷覆盖率 —— 9 种视图加上3D测量
- 斜角视图的最高分辨率
- 元件高度测量
- 通过FastFlow PCB处理功能，实现高生产率
- 运用vVision/EasyPro，快捷简便的程序制作
- 从下至上读取数据矩阵码
Feature
Very reliable high-speed 3D inspection for soldered connections
- Extremely fast AOI camera system
- Scalable, modular camera technology with 3D measuring function
- Greatest inspection depth: reliable inspection of 03015 and fine-pitch components
- Maximum fault coverage - 9 views plus 3D measurement
- Best resolution at angled views
- Height measurement of components
- Extremely high throughput due to FastFlow Handling
- Fast program generation with vVision/EasyPro
- Reading DataMatrix code, bottom up
VISCOM 附加优势
- 通过综合验证功能，可靠实现检测程序优化
- 全局库、全局校验: 可传送到所有设备
- 可追溯性, SPC、验证维修站、离线编程站
- 使用Viscom焊点检查标准元件库，采取灵活稳健的检测策略
- 最短循环周期的稳健检测
- 完全支持无铅技术
- 经长时间实践检验的、符合IPC标准的、丰富的Viscom检测库
- 根据客户需求进行软件调整
- 多语言用户界面
- Viscom Quality Uplink 优化整个进程
- 完整的统计进程分析
- 运用分析工具，独立进行Viscom实时图像处理
- 高性能的光学字符识别（OCR）软件
- 30多年AOI经验的结晶
VISSCOM-Plus
- Reliable inspection program optimization through integrated verification
- Global libraries, global calibration: Transferability to all systems
- Traceability, SPC, verification, off-line programming and much more
- Robust inspection strategies using the Viscom standard library for solder joint inspections
- Inspection in the shortest cycle time
- Lead-free technology fully supported
- Successful comprehensive IPC-conformant inspection library
- Customer-specific software adaptation
- User interface in nearly every language
- Viscom Quality Uplink for optimization of the entire process
- Complete statistical process analysis
- Independent real-time image processing with Viscom analysis tools
- High-performance OCR software
- Over 30 years of AOI experience included
檢測範圍
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焊锡不足 |
焊锡过多 |
焊锡缺失 |
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连桥/短路 |
立碑 |
翘脚 |
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焊锡不良 |
润湿性 |
污染 |
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元件缺失 |
极性缺陷 |
元件错位 |
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旋转 |
元件破损 |
错误元件 |
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元件仰卧 |
元件侧立 |
弯曲引脚 |
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破损引脚 |
元件组装过多 |
类型错误 |
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选项: |
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自由面分析 |
斜圈缺陷 |
彩环分析 |
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OCR |
焊点的吹孔 |
锡球/锡渣 |
Defect coverage
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Not enough solder |
Too much solder |
Missing solder |
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Solder bridging/short circuit |
Tombstone effect |
Lifted lead |
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Solder defects |
Solderability |
Contamination |
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Missing component |
Polarity error |
Component displaced |
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Rotation |
Component damaged |
Incorrect component |
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Face down component |
Component on its side |
Twisted pin |
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Damaged pin |
Component equipped too much |
Form defects |
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Optional: |
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Open area analysis |
Wobble circle error |
Color ring analysis |
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OCR |
Air holes in the soldered connection |
Solder ball/solder spray |
S3088 ultra – 3D AOI技术数据
S3088 ultra |
S3088 ultra gold |
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检测领域 |
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焊锡连接点、组装、焊锡印刷 |
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传感技术 |
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百万像素总数 |
可达65 |
可达121 |
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3D传感技术 |
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Z分辨率 |
0.5 µm |
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测量范围 |
可达30 mm |
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横向分辨率 |
16 µm |
10 µm |
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斜视摄像机 |
16 µm |
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百万像素相机的数量 |
4 (8、选项) |
8 |
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正交摄像机 |
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分辨率 |
8 µm |
10 µm |
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像场尺寸 |
40 x 40 mm |
50 x 50 mm |
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软件 |
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用户界面 |
Viscom vVision/EasyPro |
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SPC |
Viscom SPC (统计进程控制)、开放式界面 (选项) |
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验证维修站 |
Viscom vVerify/HARAN |
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远程诊断 |
Viscom SRC (软件远程控制) (可选) |
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编程站 |
Viscom PST34 (可选) |
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系统计算机 |
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操作系统 |
Windows® |
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处理器Intel® CoreTM i7 |
Intel® CoreTM i7 |
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电路板处理 |
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PCB大小 |
508 mm x 508 mm(长 x 宽) |
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处理高度 |
850-950 mm ± 20 mm |
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宽度设置 |
自动调整 |
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定位单元 |
同步线型构架结构 |
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传送概念 |
单轨传输 |
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印刷电路板箝位 |
气动 |
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表面上方清除尺寸 |
50 mm |
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底面下方清除尺寸 |
可达到85 mm (含PCB支架40 mm) |
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检测速度 |
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30–50 cm²/秒 |
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其他系统数据 |
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执行/定位单元 |
同步直线电机 |
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接口 |
SMEMA, SV70 |
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电源要求 |
400 V (其他电压根据需求提供)、3P/N/PE, 8A |
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系统规格 |
997 x 1600 x 1540 mm (宽 x 长 x 高) |
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重量 |
最重800公斤 |
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